JPH064545Y2 - 接続構造 - Google Patents
接続構造Info
- Publication number
- JPH064545Y2 JPH064545Y2 JP1988053085U JP5308588U JPH064545Y2 JP H064545 Y2 JPH064545 Y2 JP H064545Y2 JP 1988053085 U JP1988053085 U JP 1988053085U JP 5308588 U JP5308588 U JP 5308588U JP H064545 Y2 JPH064545 Y2 JP H064545Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- connection
- connection terminal
- terminal
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 19
- 239000004593 Epoxy Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 201000006318 hyperopia Diseases 0.000 description 1
- 230000004305 hyperopia Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988053085U JPH064545Y2 (ja) | 1988-04-19 | 1988-04-19 | 接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988053085U JPH064545Y2 (ja) | 1988-04-19 | 1988-04-19 | 接続構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01155669U JPH01155669U (en]) | 1989-10-25 |
| JPH064545Y2 true JPH064545Y2 (ja) | 1994-02-02 |
Family
ID=31279082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988053085U Expired - Lifetime JPH064545Y2 (ja) | 1988-04-19 | 1988-04-19 | 接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064545Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521509U (en]) * | 1978-07-28 | 1980-02-12 | ||
| JPH059739Y2 (en]) * | 1986-02-07 | 1993-03-10 |
-
1988
- 1988-04-19 JP JP1988053085U patent/JPH064545Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01155669U (en]) | 1989-10-25 |
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